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LPC55S36JBD100E - NXP

Description: ARM Microcontrollers - MCU Arm Cortex-M33-based Microcontroller with 8KB Cache

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LPC55S36JBD100E - NXP - PCB symbol
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PCB Footprints
LPC55S36JBD100E - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - SOT1570-5
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LPC55S36JBD100E - NXP - 3D model - Quad Flat Packages - SOT1570-5
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LPC55S36JBD100E Details

  • Manufacturer Part Number:

    LPC55S36JBD100E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LQFP-100

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    12

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M33

  • Clock Frequency-Max:

    32 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PQFP-G100

  • Length:

    14 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    68

  • Number of External Interrupts:

    8

  • Number of I/O Lines:

    66

  • Number of Serial I/Os:

    8

  • Number of Terminals:

    100

  • Number of Timers:

    10

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLFQFP

  • Package Equivalence Code:

    QFP100,.63SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    131072

  • ROM (words):

    262144

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.6 mm

  • Speed:

    150 MHz

  • Supply Current-Max:

    256 mA

  • Supply Voltage-Max:

    1.2 V

  • Supply Voltage-Min:

    1 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

LPC55S36JBD100E Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the LPC55S36JBD100E is -40°C to 105°C.
  • The clock settings for the LPC55S36JBD100E can be configured using the Clock Control Unit (CCU) registers. The CCU provides a flexible clock generation and distribution system that allows the user to configure the clock sources, dividers, and multiplexers to meet the specific requirements of the application.
  • The maximum current consumption of the LPC55S36JBD100E depends on the operating frequency, voltage, and peripherals used. According to the datasheet, the maximum current consumption is approximately 350 mA at 100 MHz and 3.3 V.
  • The LPC55S36JBD100E has a built-in TrustZone security feature that provides a secure environment for executing sensitive code and storing sensitive data. To use TrustZone, you need to configure the Secure Attribution Unit (SAU) and the TrustZone controller, and then write secure code that runs in the secure world. NXP provides a TrustZone software development kit (SDK) that includes documentation, examples, and tools to help you get started.
  • Yes, the LPC55S36JBD100E can be used with an external crystal oscillator. The microcontroller has an on-chip oscillator that can be used as a clock source, but you can also use an external crystal oscillator as a clock source. The external crystal oscillator is connected to the XTALIN and XTALOUT pins, and the clock frequency can be configured using the Clock Control Unit (CCU) registers.

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LPC55S36JBD100E Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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