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LPC55S66JBD64E - NXP

Description: NXP Semiconductors High Efficiency Arm<sup> </sup> Cortex<sup> </sup>-M33-based Microcontroller

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LPC55S66JBD64E - NXP - PCB symbol
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PCB Footprints
LPC55S66JBD64E - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - SOT855-5
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3D Models
LPC55S66JBD64E - NXP - 3D model - Quad Flat Packages - SOT855-5
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LPC55S66JBD64E Details

  • Manufacturer Part Number:

    LPC55S66JBD64E

  • Part Life Cycle Code:

    Active

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    8

  • Moisture Sensitivity Level:

    3

  • Peak Reflow Temperature (Cel):

    260

  • Terminal Finish:

    Tin (Sn)

  • Time@Peak Reflow Temperature-Max (s):

    30

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

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LPC55S66JBD64E Overview

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To find more CAD model downloads similar to this part, try a partial part number search, like LPC55, or try a keyword search, such as Microcontrollers

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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