LPC55S66JBD64K - NXP

LPC55S66JBD64K Details

• Manufacturer Part Number:

  LPC55S66JBD64K

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  HTQFP-64

• Country Of Origin:

  Taiwan

• ECCN Code:

  5A992.C

• HTS Code:

  8542.31.00.25

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  8

• Has ADC:

  YES

• Bit Size:

  32

• Boundary Scan:

  YES

• CPU Family:

  CORTEX-M33

• Clock Frequency-Max:

  32 MHz

• DAC Channels:

  NO

• DMA Channels:

  YES

• Format:

  FLOATING POINT

• Integrated Cache:

  NO

• JESD-30 Code:

  S-PQFP-G64

• JESD-609 Code:

  e3

• Length:

  10 mm

• Low Power Mode:

  YES

• Moisture Sensitivity Level:

  3

• Number of DMA Channels:

  33

• Number of External Interrupts:

  8

• Number of I/O Lines:

  36

• Number of Serial I/Os:

  9

• Number of Terminals:

  64

• Number of Timers:

  9

• On Chip Data RAM Width:

  8

• On Chip Program ROM Width:

  8

• Operating Temperature-Max:

  105 °C

• Operating Temperature-Min:

  -40 °C

• PWM Channels:

  YES

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  HTFQFP

• Package Equivalence Code:

  TQFP64,.47SQ

• Package Shape:

  SQUARE

• Package Style:

  FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• RAM (bytes):

  147456

• ROM (words):

  262144

• ROM Programmability:

  FLASH

• Seated Height-Max:

  1.2 mm

• Speed:

  150 MHz

• Supply Voltage-Max:

  3.6 V

• Supply Voltage-Min:

  3 V

• Supply Voltage-Nom:

  3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Tin (Sn)

• Terminal Form:

  GULL WING

• Terminal Pitch:

  0.5 mm

• Terminal Position:

  QUAD

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  10 mm

• uPs/uCs/Peripheral ICs Type:

  MICROCONTROLLER, RISC