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LPC802M001JDH20 - NXP

Description: System:  ARM Cortex-M0+ processor (revision r0p1), running at frequencies of up to 15 MHz with single-cycle multiplier and fast single-cycle I/O port.  ARM Cortex-M0+ built-in Nested Vectored Interrupt Controller (NVIC).  System tick timer.  AHB multilayer matrix.  Serial Wire Debug (SWD) with four break points and two watch points. JTAG boundary scan (BSDL) supported.  Memory:  16 KB on-chip EEPROM based flash programming memory.  Code Read Protection (CRP).  2 KB SRAM.  Dual I/O powe

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LPC802M001JDH20 - NXP PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
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LPC802M001JDH20 - NXP  - 3D model - Small Outline Packages - TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for LPC802M001JDH20
  • Part Number LPC802M001JDH20
  • Manufacturer NXP
  • Pin Count 20
  • Part Category Integrated Circuit
  • Package Category Small Outline Packages
  • Footprint Name Small Outline Packages - TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
  • Released Date May 19, 2025
  • Last Modified Date May 19, 2025 8:57 AM UTC
  • Pinout / Pin List Click Here (Member Only)

LPC802M001JDH20 Details

  • Manufacturer Part Number:

    LPC802M001JDH20

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP-20

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.25

  • Date Of Intro:

    2018-03-12

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    7.73

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • JESD-30 Code:

    R-PDSO-G20

  • Length:

    6.5 mm

  • Number of I/O Lines:

    17

  • Number of Terminals:

    20

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • RAM (bytes):

    2048

  • ROM (words):

    16384

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.1 mm

  • Speed:

    15 MHz

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.71 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    4.4 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

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LPC802M001JDH20 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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