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LPC802M001JDH20FP - NXP

Description: ARM Microcontrollers - MCU Cortex-M0 16KB 2KB I2c, SPI, 16 GPIO

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LPC802M001JDH20FP - NXP PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
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3D Models
LPC802M001JDH20FP - NXP  - 3D model - Small Outline Packages - TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for LPC802M001JDH20FP
  • Part Number LPC802M001JDH20FP
  • Manufacturer NXP
  • Pin Count 20
  • Part Category Integrated Circuit
  • Package Category Small Outline Packages
  • Footprint Name Small Outline Packages - TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
  • Released Date Aug 16, 2020
  • Last Modified Date Mar 7, 2023 4:10 PM UTC
  • Pinout / Pin List Click Here (Member Only)

LPC802M001JDH20FP Details

  • Manufacturer Part Number:

    LPC802M001JDH20FP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP-20

  • Country Of Origin:

    Mainland China, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    7

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M0

  • Clock Frequency-Max:

    15 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    R-PDSO-G20

  • Length:

    6.5 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of External Interrupts:

    8

  • Number of I/O Lines:

    17

  • Number of Serial I/Os:

    2

  • Number of Terminals:

    20

  • Number of Timers:

    5

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    2048

  • ROM (words):

    16384

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.1 mm

  • Speed:

    15 MHz

  • Supply Current-Max:

    40 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.71 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

LPC802M001JDH20FP Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the LPC802M001JDH20FP is 30 MHz.
  • The LPC802M001JDH20FP has 8 KB of flash memory.
  • The voltage range for the LPC802M001JDH20FP is 1.8 V to 3.6 V.
  • Yes, the LPC802M001JDH20FP has a built-in oscillator that can be used as a clock source.
  • The current consumption of the LPC802M001JDH20FP in sleep mode is typically around 1.5 μA.

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LPC802M001JDH20FP Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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