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LPC811M001JDH16FP - NXP

Description: NXP - LPC811M001JDH16FP - MCU, 32BIT, CORTEX-M0+, 30MHZ, TSSOP-16

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PCB Footprints
LPC811M001JDH16FP - NXP PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP−16 (SOT403-1)
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LPC811M001JDH16FP - NXP  - 3D model - Small Outline Packages - TSSOP−16 (SOT403-1)
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LPC811M001JDH16FP Details

  • Manufacturer Part Number:

    LPC811M001JDH16FP

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    4.40 MM, PLASTIC, MO-153, SOT403-1, TSSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    SOT403-1

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Has ADC:

    NO

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M0

  • Clock Frequency-Max:

    25 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • JESD-30 Code:

    R-PDSO-G16

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of I/O Lines:

    14

  • Number of Terminals:

    16

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    8192

  • ROM (words):

    2048

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.1 mm

  • Speed:

    30 MHz

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

LPC811M001JDH16FP Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the LPC811M001JDH16FP is -40°C to 105°C.
  • The clock source for the LPC811M001JDH16FP can be configured using the Clock Generation Unit (CGU) registers. The CGU allows the selection of the clock source, clock frequency, and clock mode.
  • The maximum current consumption of the LPC811M001JDH16FP is approximately 20mA at 3.3V and 48MHz.
  • The ADC on the LPC811M001JDH16FP can be used by configuring the ADC registers, selecting the ADC channel, and starting the ADC conversion. The ADC result can be read from the ADC result register.
  • Yes, the LPC811M001JDH16FP can be used with an external crystal oscillator. The external crystal oscillator can be connected to the XTALIN and XTALOUT pins, and the clock source can be configured to use the external crystal oscillator.

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LPC811M001JDH16FP Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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