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LPC811M001JDH16J - NXP

Description: ARM Microcontrollers - MCU 32bit ARM Cortex-M0+ microcontroller

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LPC811M001JDH16J - NXP PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
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3D Models
LPC811M001JDH16J - NXP  - 3D model - Small Outline Packages - TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for LPC811M001JDH16J
  • Part Number LPC811M001JDH16J
  • Manufacturer NXP
  • Pin Count 16
  • Part Category Integrated Circuit
  • Package Category Small Outline Packages
  • Footprint Name Small Outline Packages - TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
  • Released Date Sep 3, 2021
  • Last Modified Date Mar 7, 2023 4:10 PM UTC
  • Pinout / Pin List Click Here (Member Only)

LPC811M001JDH16J Details

  • Manufacturer Part Number:

    LPC811M001JDH16J

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    4.40 MM, PLASTIC, MO-153, SOT403-1, TSSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    SOT403-1

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Has ADC:

    NO

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M0

  • Clock Frequency-Max:

    25 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • JESD-30 Code:

    R-PDSO-G16

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of I/O Lines:

    14

  • Number of Terminals:

    16

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    8192

  • ROM (words):

    2048

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.1 mm

  • Speed:

    30 MHz

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

LPC811M001JDH16J Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the LPC811 is 30 MHz.
  • The LPC811 has 16 KB of flash memory.
  • The LPC811 operates at a voltage range of 1.8 V to 3.6 V.
  • Yes, the LPC811 has a built-in oscillator that can be used as a clock source.
  • The current consumption of the LPC811 in sleep mode is typically around 10 μA.

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LPC811M001JDH16J Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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