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LPC812M101JTB16X - NXP

Description: ARM Microcontrollers - MCU 32-bit ARM Cortex M0+ MCU

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PCB Footprints
LPC812M101JTB16X - NXP PCB footprint - Small Outline No-lead - Small Outline No-lead - XSON16
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LPC812M101JTB16X - NXP  - 3D model - Small Outline No-lead - XSON16
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LPC812M101JTB16X Details

  • Manufacturer Part Number:

    LPC812M101JTB16X

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SON

  • Package Description:

    2.50 X 3.20 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT1341-1, XSON-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    SOT1341-1

  • Country Of Origin:

    Thailand

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Has ADC:

    NO

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    25 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • JESD-30 Code:

    R-PDSO-N16

  • Length:

    3.2 mm

  • Moisture Sensitivity Level:

    1

  • Number of I/O Lines:

    14

  • Number of Terminals:

    16

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSON

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • ROM (words):

    16384

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    0.5 mm

  • Speed:

    30 MHz

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.5 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

LPC812M101JTB16X Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the LPC812 is 30 MHz.
  • The LPC812 has 16 KB of flash memory.
  • Yes, the LPC812 is designed for low-power applications and has a low power consumption of 130 μA/MHz in active mode and 20 μA in sleep mode.
  • Yes, the LPC812 has 4-channel, 12-bit ADCs with a conversion rate of up to 400 kHz.
  • Yes, the LPC812 is suitable for industrial control applications due to its high reliability, low power consumption, and ability to operate in a wide temperature range (-40°C to 105°C).

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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