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LPC822M101JHI33E - NXP

Description: NXP - LPC822M101JHI33E - MCU, 32BIT, CORTEX-M0+, 30MHZ, HVQFN-33

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PCB Footprints
LPC822M101JHI33E - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - HVQFN-32
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3D Models
LPC822M101JHI33E - NXP  - 3D model - Quad Flat No-Lead - HVQFN-32
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LPC822M101JHI33E Details

  • Manufacturer Part Number:

    LPC822M101JHI33E

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    HVQFN-33

  • Pin Count:

    32

  • Manufacturer Package Code:

    SOT617-3

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M0

  • Clock Frequency-Max:

    25 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQCC-N33

  • Length:

    5 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    18

  • Number of External Interrupts:

    8

  • Number of I/O Lines:

    29

  • Number of Serial I/Os:

    3

  • Number of Terminals:

    33

  • Number of Timers:

    4

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC33,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    4096

  • ROM (words):

    16384

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    0.85 mm

  • Speed:

    30 MHz

  • Supply Current-Max:

    100 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.8 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

LPC822M101JHI33E Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the LPC822M101JHI33E is -40°C to 105°C.
  • The clock source for the LPC822M101JHI33E can be configured using the Clock Generation Unit (CGU) registers. The CGU allows the selection of the clock source, clock frequency, and clock mode.
  • The maximum current consumption of the LPC822M101JHI33E is approximately 20mA at 3.3V and 48MHz.
  • The ADC on the LPC822M101JHI33E can be used by configuring the ADC registers, selecting the ADC channel, and starting the ADC conversion. The ADC result can be read from the ADC result register.
  • Yes, the LPC822M101JHI33E can be used with an external crystal oscillator. The external crystal oscillator can be connected to the XTALIN and XTALOUT pins, and the clock source can be selected using the CGU registers.

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LPC822M101JHI33E Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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