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LPC845M301JHI33Y - NXP

Description: NXP - LPC845M301JHI33Y - MCU, 32BIT, 30MHZ, HVQFN-33

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PCB Footprints
LPC845M301JHI33Y - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 5 x 5 x 0.85 mm
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3D Models
LPC845M301JHI33Y - NXP  - 3D model - Quad Flat No-Lead - 5 x 5 x 0.85 mm
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LPC845M301JHI33Y Details

  • Manufacturer Part Number:

    LPC845M301JHI33Y

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HVQFN-33

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    6

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M0

  • Clock Frequency-Max:

    25 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQCC-N33

  • Length:

    5 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    25

  • Number of External Interrupts:

    8

  • Number of I/O Lines:

    29

  • Number of Serial I/Os:

    5

  • Number of Terminals:

    33

  • Number of Timers:

    8

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC33,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    16384

  • ROM (words):

    65536

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    0.85 mm

  • Speed:

    30 MHz

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.8 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

LPC845M301JHI33Y Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the LPC845M301JHI33Y is -40°C to 105°C.
  • The clock settings for the LPC845M301JHI33Y can be configured using the Clock Control Unit (CCU) registers. The CCU provides a flexible clocking scheme that allows the user to configure the clock sources, dividers, and multiplexers to generate the desired clock frequencies.
  • The maximum current consumption of the LPC845M301JHI33Y is approximately 120 mA at 3.3V and 48 MHz.
  • The ADC on the LPC845M301JHI33Y is a 12-bit successive approximation register (SAR) ADC. To use the ADC, the user must configure the ADC clock, select the ADC channel, and start the ADC conversion. The ADC result can be read from the ADC result register.
  • Yes, the LPC845M301JHI33Y can be used with an external crystal oscillator. The microcontroller has an on-chip oscillator circuit that can be connected to an external crystal or ceramic resonator to generate the clock signal.

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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