LQG15HSR15H02D - Murata Electronics

LQG15HSR15H02D Frequently Asked Questions (FAQs)

• What is the recommended land pattern for LQG15HSR15H02D?
  The recommended land pattern for LQG15HSR15H02D is a rectangular pad with a size of 1.5 mm x 1.5 mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask opening of 1.2 mm x 1.2 mm.
• How do I handle the LQG15HSR15H02D inductor during reflow soldering?
  During reflow soldering, the LQG15HSR15H02D inductor should be placed on the PCB with the component marking side facing up. The recommended reflow profile is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C.
• Is the LQG15HSR15H02D inductor suitable for high-frequency applications?
  Yes, the LQG15HSR15H02D inductor is designed for high-frequency applications, with a self-resonant frequency of 100 MHz. However, the inductor's performance may degrade at frequencies above 50 MHz, and additional simulation and testing may be required to ensure optimal performance.
• Can I use the LQG15HSR15H02D inductor in a high-temperature environment?
  The LQG15HSR15H02D inductor is rated for operation up to 125°C, but its performance may degrade at high temperatures. If your application requires operation above 125°C, you should consult with Murata's application engineers to determine the inductor's suitability and potential derating requirements.
• How do I ensure the LQG15HSR15H02D inductor is properly secured to the PCB?
  The LQG15HSR15H02D inductor should be secured to the PCB using a suitable adhesive, such as a cyanoacrylate-based adhesive, to prevent movement and vibration during operation. Additionally, the inductor's leads should be soldered to the PCB to ensure a reliable electrical connection.