LQM2MPNR47MEHL - Murata Electronics

LQM2MPNR47MEHL Frequently Asked Questions (FAQs)

• What is the recommended land pattern for the LQM2MPNR47MEHL?
  The recommended land pattern for the LQM2MPNR47MEHL is a rectangular pad with a size of 2.5mm x 1.6mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask opening of 2.2mm x 1.3mm.
• How do I handle the component's thermal considerations?
  The LQM2MPNR47MEHL has a maximum operating temperature of 125°C. To ensure reliable operation, it's essential to provide adequate thermal relief by using thermal vias, thermal pads, or heat sinks, especially in high-power applications.
• What is the recommended soldering profile for the LQM2MPNR47MEHL?
  Murata recommends a soldering profile with a peak temperature of 260°C, a dwell time above 220°C of 30-60 seconds, and a total process time of 60-120 seconds. It's essential to follow the recommended soldering profile to prevent damage to the component.
• Can I use the LQM2MPNR47MEHL in a high-vibration environment?
  The LQM2MPNR47MEHL is designed to withstand moderate vibration levels. However, in high-vibration environments, it's recommended to use additional mechanical support, such as potting or encapsulation, to ensure the component's reliability and prevent mechanical stress.
• How do I ensure the component's reliability in high-humidity environments?
  To ensure reliability in high-humidity environments, it's recommended to use a conformal coating or potting material that meets the IPC-CC-830B standard. Additionally, ensure that the component is stored in a dry environment before assembly and that the assembly process follows proper humidity control procedures.