MORNSUN recommends a PCB layout with a large copper area for heat dissipation, and a thermal via under the device to improve heat transfer. A thermal pad or heat sink can also be used to further reduce thermal resistance.
To ensure reliability in high-temperature environments, MORNSUN recommends following the derating curves provided in the datasheet, using a suitable heat sink or thermal management system, and ensuring good airflow around the device.
The maximum allowable capacitance for the output capacitor is 220uF. Exceeding this value may cause instability or oscillation in the output voltage.
Yes, the LS05-26B12SS can be used in a redundant or parallel configuration, but it's essential to ensure that the devices are properly synchronized and that the output capacitors are properly sized to prevent oscillation or instability.
MORNSUN recommends using a low-ESR ceramic capacitor with a value of 10uF to 22uF for the input capacitor. This helps to reduce input ripple and improve overall performance.
Trust Checks
This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
LS05-26B12SS Overview
Use the download button to access the LS05-26B12SS schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like LS05-,
or try a keyword search, such as Power Supply Modules