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LS1012AXE7HKB - NXP

Description: Microprocessors - MPU LS1012A XT WE 800MHZ Rv2

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LS1012AXE7HKB - NXP PCB footprint - Other - Other - LS1012AXE7HKB-6
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LS1012AXE7HKB - NXP  - 3D model - Other - LS1012AXE7HKB-6
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LS1012AXE7HKB Details

  • Manufacturer Part Number:

    LS1012AXE7HKB

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCLGA-211

  • ECCN Code:

    5A002.A.1

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • JESD-30 Code:

    S-XBGA-N211

  • Length:

    9.6 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    211

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFLGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.925 mm

  • Supply Voltage-Max:

    0.93 V

  • Supply Voltage-Min:

    0.87 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    9.6 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

LS1012AXE7HKB Frequently Asked Questions (FAQs)

  • NXP provides a reference design and layout guidelines in the LS1012AXE7HKB evaluation board user manual. Additionally, the NXP PCB design guidelines document provides general guidelines for PCB layout and thermal management. It's recommended to follow these guidelines to ensure optimal performance and thermal dissipation.
  • To optimize power consumption, use the power management features of the LS1012AXE7HKB, such as dynamic voltage and frequency scaling, clock gating, and power gating. Additionally, use low-power modes, such as sleep and standby, when the processor is not in use. NXP provides power management guidelines and examples in the LS1012AXE7HKB reference manual.
  • The recommended settings for the DDR memory interface can be found in the LS1012AXE7HKB datasheet and reference manual. NXP also provides a DDR memory interface design guide that provides detailed guidelines for configuring the DDR interface, including timing parameters, signal integrity, and layout considerations.
  • To ensure reliable booting, follow the boot sequence guidelines provided in the LS1012AXE7HKB reference manual. Use a reliable boot source, such as a serial flash or eMMC, and ensure that the boot configuration is correct. Additionally, use the boot failure detection and recovery mechanisms provided by the LS1012AXE7HKB to detect and recover from boot failures.
  • The thermal limitations of the LS1012AXE7HKB are specified in the datasheet, including the maximum junction temperature (Tj) and the thermal resistance (Rthja). It's essential to ensure that the device operates within these thermal limits to prevent overheating and ensure reliable operation. NXP provides thermal management guidelines and examples in the LS1012AXE7HKB reference manual.

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LS1012AXE7HKB Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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