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LS1012AXN7HKB - NXP

Description: Microprocessors - MPU LS1012A - XT PFE GbE PCIe SATA 800 R2

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LS1012AXN7HKB Details

  • Manufacturer Part Number:

    LS1012AXN7HKB

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCLGA-211

  • ECCN Code:

    3A991.A.1

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • JESD-30 Code:

    S-XBGA-N211

  • Length:

    9.6 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    211

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFLGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.925 mm

  • Supply Voltage-Max:

    0.93 V

  • Supply Voltage-Min:

    0.87 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    9.6 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

LS1012AXN7HKB Frequently Asked Questions (FAQs)

  • NXP provides a reference design and layout guidelines in the LS1012A datasheet and application notes. Additionally, NXP recommends following the JEDEC standards for thermal design and using thermal simulation tools to optimize the design.
  • Optimizing power consumption requires careful selection of clock frequencies, voltage levels, and power modes. NXP provides power consumption estimates and guidelines in the datasheet. Engineers can also use NXP's power estimation tools and simulation models to optimize their design.
  • NXP provides recommended settings for the DDR memory interface in the datasheet and application notes. Engineers should follow the JEDEC standards for DDR memory interface design and use NXP's DDR calibration and training tools to ensure reliable operation.
  • NXP provides a secure boot mechanism and guidelines in the datasheet and application notes. Engineers should use NXP's secure boot tools and follow the recommended secure boot flow to ensure the integrity of their firmware.
  • NXP provides temperature and environmental specifications in the datasheet. Engineers should carefully review these specifications and consider additional thermal management and protection measures for high-temperature or harsh environments.

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LS1012AXN7HKB Overview

Use the download button to access the LS1012AXN7HKB 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like LS101, or try a keyword search, such as Other uPs/uCs/Peripheral ICs

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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