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LS1017AXE7NQA - NXP

Description: LS1017A-1300 XT SEC

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PCB Footprints
LS1017AXE7NQA - NXP PCB footprint - BGA - BGA - FBGA-448
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3D Models
LS1017AXE7NQA - NXP  - 3D model - BGA - FBGA-448
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LS1017AXE7NQA Details

  • Manufacturer Part Number:

    LS1017AXE7NQA

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-448

  • ECCN Code:

    5A002.A.1

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    7

  • JESD-30 Code:

    S-PBGA-B448

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    448

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA448,30X30,30

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.61 mm

  • Supply Voltage-Max:

    1.03 V

  • Supply Voltage-Min:

    0.97 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.75 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    17 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

LS1017AXE7NQA Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout guide for the LS1017AXE7NQA in their application note AN12213, which includes guidelines for thermal vias, heat sinks, and PCB material selection to ensure optimal thermal performance.
  • The LS1017AXE7NQA has various power-saving features, such as dynamic voltage and frequency scaling, clock gating, and power domains. Engineers can configure these features using the device's power management controller (PMC) and clock controller (CC) registers. NXP provides detailed information on power management in their LS1017A reference manual.
  • NXP provides a DDR memory interface guide for the LS1017AXE7NQA, which includes recommended settings for DDR frequency, voltage, and timing parameters. Engineers can also refer to the device's datasheet and reference manual for more information on DDR memory interface configuration.
  • The LS1017AXE7NQA has a secure boot mechanism that ensures the authenticity and integrity of the boot process. Engineers can implement secure boot using the device's boot ROM and secure boot firmware, which is provided by NXP. NXP also provides a secure boot guide and reference manual for the LS1017AXE7NQA.
  • The LS1017AXE7NQA has a maximum junction temperature (Tj) of 105°C. Engineers should ensure that the device's operating temperature is within the recommended range by using thermal design techniques such as heat sinks, thermal interfaces, and airflow management. NXP provides thermal design guidelines and thermal models for the LS1017AXE7NQA in their datasheet and application notes.

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LS1017AXE7NQA Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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