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LS1023AXN7KQB - NXP

Description: Layerscape 64-bit Arm Cortex-A53, Dual-core, 1.0GHz, -40 to 105C, Security disabled, 21x21 pkg

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LS1023AXN7KQB Details

  • Manufacturer Part Number:

    LS1023AXN7KQB

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-621

  • ECCN Code:

    3A991.A.1

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    9

  • Additional Feature:

    ALSO OPERATES AT 1V SUPPLY NOM

  • JESD-30 Code:

    S-PBGA-B621

  • JESD-609 Code:

    e1

  • Length:

    21 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    621

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA621,25X25,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    250

  • Seated Height-Max:

    2.07 mm

  • Supply Voltage-Max:

    0.93 V

  • Supply Voltage-Min:

    0.87 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    21 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

LS1023AXN7KQB Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout and thermal management guide in the LS1023A Reference Manual (RM) and the LS1023A Thermal Design Guide. These documents provide detailed information on PCB layout, thermal vias, and heat sink design to ensure optimal performance and thermal management.
  • To optimize power consumption, use the power management features of the LS1023AXN7KQB, such as dynamic voltage and frequency scaling, clock gating, and power gating. Additionally, use the NXP-provided power management APIs and drivers to optimize power consumption in your application.
  • The LS1023AXN7KQB has a range of security features, including a TrustZone-enabled ARM Cortex-A7 processor, secure boot, and a hardware-based cryptographic accelerator. It also supports secure protocols such as HTTPS and SSH. For more information, refer to the LS1023A Security Reference Manual.
  • Yes, the LS1023AXN7KQB is rated for industrial temperature range (-40°C to 105°C). However, it's essential to follow the recommended thermal management guidelines and ensure proper cooling to maintain reliability and performance.
  • NXP provides a range of development tools and software for the LS1023AXN7KQB, including the LS1023A Development Kit, the NXP SDK, and the Yocto Project-based Linux BSP. Additionally, third-party tools and software are available from partners and the open-source community.

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LS1023AXN7KQB Overview

Use the download button to access the LS1023AXN7KQB 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like LS102, or try a keyword search, such as Other uPs/uCs/Peripheral ICs

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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