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LS1043ASE7KQB - NXP

Description: NXP - LS1043ASE7KQB - QorIQ, 4xCPU 64-Bit ARM Arch, 1.0GHz, DDR3L/4, PCIe, 1/10GbE, HW Accel, 0 to 105C, 21x21 pkg Proto

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PCB Footprints
LS1043ASE7KQB - NXP PCB footprint - BGA - BGA - SOT1661-1-1
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3D Models
LS1043ASE7KQB - NXP  - 3D model - BGA - SOT1661-1-1
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LS1043ASE7KQB Details

  • Manufacturer Part Number:

    LS1043ASE7KQB

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-621

  • ECCN Code:

    5A002.A.1

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    9

  • Additional Feature:

    ALSO OPERATES AT 1V NOMINAL SUPPLY

  • Address Bus Width:

    16

  • Bit Size:

    64

  • Boundary Scan:

    YES

  • External Data Bus Width:

    32

  • Format:

    FIXED POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PBGA-B621

  • JESD-609 Code:

    e1

  • Length:

    21 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    621

  • Operating Temperature-Max:

    105 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    250

  • Seated Height-Max:

    2.07 mm

  • Speed:

    1000 MHz

  • Supply Voltage-Max:

    0.93 V

  • Supply Voltage-Min:

    0.87 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    21 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

LS1043ASE7KQB Frequently Asked Questions (FAQs)

  • NXP provides a reference design and layout guidelines in the LS1043A datasheet and application notes. Additionally, NXP recommends following the JEDEC standards for thermal design and using thermal simulation tools to optimize the design.
  • Optimizing power consumption and reducing heat generation can be achieved by using the LS1043A's power management features, such as dynamic voltage and frequency scaling, and by optimizing the system's clock frequencies and voltage levels. NXP provides guidelines and tools to help with power optimization.
  • NXP provides recommended settings for the DDR memory interface in the LS1043A datasheet and application notes. Additionally, NXP recommends following the JEDEC standards for DDR memory interface design and using signal integrity analysis tools to ensure reliable operation.
  • NXP provides a secure boot mechanism in the LS1043A, which can be implemented using the device's boot ROM and secure boot firmware. NXP also recommends following industry-standard security guidelines and using secure boot tools and libraries to ensure the integrity of the system's firmware.
  • The LS1043A is rated for operation up to 105°C, but NXP recommends following specific guidelines for high-temperature operation, such as reducing clock frequencies and voltage levels, and using thermal simulation tools to ensure reliable operation. Additionally, NXP recommends following industry-standard guidelines for designing systems for harsh environments.

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LS1043ASE7KQB Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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