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LS1046ASE8T1A - NXP

Description: Microprocessors - MPU Layerscape 64-bit Arm Cortex-A72, Quad-core, 1.8GHz, 0 to 105C, Security enabled

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Symbol
LS1046ASE8T1A - NXP - PCB symbol
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PCB Footprints
LS1046ASE8T1A - NXP PCB footprint - BGA - BGA - FBGA780
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3D Models
LS1046ASE8T1A - NXP - 3D model - BGA - FBGA780
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LS1046ASE8T1A Details

  • Manufacturer Part Number:

    LS1046ASE8T1A

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-780

  • ECCN Code:

    5A002.A.1

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    9

  • JESD-30 Code:

    S-PBGA-B780

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    780

  • Operating Temperature-Max:

    105 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA780,28X28,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    250

  • Seated Height-Max:

    2.07 mm

  • Supply Voltage-Max:

    1.03 V

  • Supply Voltage-Min:

    0.97 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    23 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

LS1046ASE8T1A Frequently Asked Questions (FAQs)

  • NXP provides a reference design guide for the LS1046A series, which includes guidelines for PCB layout, thermal design, and power delivery. It's recommended to follow these guidelines to ensure optimal performance and reliability.
  • To optimize power consumption, use the power management features of the LS1046ASE8T1A, such as dynamic voltage and frequency scaling, and power gating. Additionally, optimize the system design to minimize power consumption, and use low-power modes when possible.
  • The recommended settings for the DDR4 memory interface can be found in the LS1046A series reference manual. It's recommended to follow the guidelines for memory timing, voltage, and signal integrity to ensure reliable operation.
  • NXP provides a secure boot solution for the LS1046A series, which includes a secure boot ROM and a cryptographic engine. Follow the secure boot implementation guide provided by NXP to ensure a secure boot process.
  • The LS1046ASE8T1A has a maximum junction temperature of 105°C. Ensure proper thermal management by using a heat sink, thermal interface material, and a cooling system to keep the device within the recommended operating temperature range.

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LS1046ASE8T1A Overview

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To find more CAD model downloads similar to this part, try a partial part number search, like LS104, or try a keyword search, such as Other uPs/uCs/Peripheral ICs

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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