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LS1046ASN8Q1A - NXP

Description: NXP - LS1046ASN8Q1A - QORIQ LAYERSCAPE 4XA72 64BIT ARM-1.6G DDR4-2.1G PCIE 1/10GBE SATA USB 0-105C 23X23PKG 1.0V, TRAY MULTIPLE DP BAKEABLE, TRAY

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PCB Footprints
LS1046ASN8Q1A - NXP PCB footprint - BGA - BGA - SOT1653-1-5
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LS1046ASN8Q1A - NXP  - 3D model - BGA - SOT1653-1-5
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LS1046ASN8Q1A Details

  • Manufacturer Part Number:

    LS1046ASN8Q1A

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-780

  • ECCN Code:

    3A991.A.1

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    9

  • JESD-30 Code:

    S-PBGA-B780

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    780

  • Operating Temperature-Max:

    105 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA780,28X28,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    250

  • Seated Height-Max:

    2.07 mm

  • Supply Voltage-Max:

    1.03 V

  • Supply Voltage-Min:

    0.97 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    23 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

LS1046ASN8Q1A Frequently Asked Questions (FAQs)

  • The recommended thermal design for the LS1046ASN8Q1A involves using a heat sink with a thermal interface material (TIM) to dissipate heat. The heat sink should be designed to keep the junction temperature (TJ) below 105°C. NXP provides a thermal design guide that includes guidelines for heat sink selection, thermal interface material selection, and thermal design considerations.
  • To optimize power consumption on the LS1046ASN8Q1A, engineers can use various power-saving features such as dynamic voltage and frequency scaling (DVFS), clock gating, and power gating. Additionally, optimizing software and firmware to minimize CPU utilization, using low-power modes, and disabling unused peripherals can also help reduce power consumption.
  • When designing a power supply for the LS1046ASN8Q1A, engineers should consider the power requirements of the device, including the voltage and current requirements of each power rail. They should also ensure that the power supply can handle the inrush current, and that the voltage regulators are stable and efficient. Additionally, engineers should consider using power sequencing, voltage monitoring, and overcurrent protection to ensure reliable operation.
  • To ensure signal integrity on the LS1046ASN8Q1A's high-speed interfaces, engineers should follow best practices for PCB design, such as using controlled impedance traces, minimizing trace length, and using signal shielding. They should also consider using signal conditioning components, such as terminators and filters, to improve signal quality. Additionally, engineers should simulate and analyze the signal integrity of their design using tools such as IBIS-AMI models and signal integrity analysis software.
  • The LS1046ASN8Q1A has various security features, including secure boot, trusted execution environment (TEE), and cryptographic acceleration. Engineers should consider implementing secure boot mechanisms to ensure the authenticity and integrity of the software and firmware. They should also use secure protocols for communication and data storage, and implement access controls and secure key management practices.

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LS1046ASN8Q1A Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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