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LS1046AXE8T1A - NXP

Description: Microprocessors - MPU Layerscape 64-bit Arm Cortex-A72, Quad-core, 1.8GHz, -40 to 105C, Security enabled

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LS1046AXE8T1A Details

  • Manufacturer Part Number:

    LS1046AXE8T1A

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-780

  • ECCN Code:

    5A002.A.1

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    9

  • JESD-30 Code:

    S-PBGA-B780

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    780

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA780,28X28,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    250

  • Seated Height-Max:

    2.07 mm

  • Supply Voltage-Max:

    1.03 V

  • Supply Voltage-Min:

    0.97 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    23 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

LS1046AXE8T1A Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the LS1046AXE8T1A is -40°C to 105°C.
  • The DDR memory interface on the LS1046AXE8T1A can be configured using the DDR controller registers. Refer to the LS1046AXE8T1A reference manual for detailed information on configuring the DDR memory interface.
  • The maximum frequency of the CPU on the LS1046AXE8T1A is 1.6 GHz.
  • Secure boot on the LS1046AXE8T1A can be implemented using the Secure Boot mechanism, which involves generating a secure boot image and storing it in the boot device. Refer to the LS1046AXE8T1A reference manual for detailed information on implementing secure boot.
  • The power consumption of the LS1046AXE8T1A varies depending on the operating frequency and usage. The typical power consumption is around 10W, but it can be as low as 2W in low-power modes.

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LS1046AXE8T1A Overview

Use the download button to access the LS1046AXE8T1A 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like LS104, or try a keyword search, such as Other uPs/uCs/Peripheral ICs

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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