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LS1088ASE7Q1A - NXP

Description: Microprocessors - MPU 1600/2100 WE RvA

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Symbol
LS1088ASE7Q1A - NXP - PCB symbol
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PCB Footprints
LS1088ASE7Q1A - NXP PCB footprint - BGA - BGA - SOT1653-1
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3D Models
LS1088ASE7Q1A - NXP - 3D model - BGA - SOT1653-1
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LS1088ASE7Q1A Details

  • Manufacturer Part Number:

    LS1088ASE7Q1A

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-780

  • ECCN Code:

    5A002.A.1

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    9

  • JESD-30 Code:

    S-PBGA-B780

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    780

  • Operating Temperature-Max:

    105 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA780,28X28,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    250

  • Seated Height-Max:

    2.61 mm

  • Supply Voltage-Max:

    1.055 V

  • Supply Voltage-Min:

    0.995 V

  • Supply Voltage-Nom:

    1.025 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    23 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

LS1088ASE7Q1A Frequently Asked Questions (FAQs)

  • NXP provides a reference design and layout guidelines in the LS1088ASE7Q1A Reference Manual (RM) and the NXP PowerQUICC III Processor Family Thermal Design Guide. Additionally, NXP recommends consulting with a thermal expert or using thermal simulation tools to ensure optimal heat dissipation.
  • NXP provides guidelines for DDR memory interface optimization in the LS1088ASE7Q1A DDR Memory Interface Application Note. This includes recommendations for memory timing, signal integrity, and calibration. Additionally, NXP recommends using the NXP-provided DDR calibration tool to optimize memory performance.
  • NXP provides power sequencing and voltage rail requirements in the LS1088ASE7Q1A datasheet and the NXP PowerQUICC III Processor Family Power Management Application Note. It is essential to follow these guidelines to ensure proper device operation and prevent damage.
  • NXP provides guidelines for secure boot and firmware updates in the LS1088ASE7Q1A Security Reference Manual and the NXP Secure Boot Solution for PowerQUICC Processors Application Note. This includes recommendations for using the device's security features, such as the Secure Boot ROM and the Trust Architecture.
  • NXP provides guidelines for using the LS1088ASE7Q1A in high-temperature or harsh environments in the LS1088ASE7Q1A datasheet and the NXP PowerQUICC III Processor Family Environmental and Reliability Application Note. This includes recommendations for temperature derating, humidity, and vibration considerations.

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LS1088ASE7Q1A Overview

Use the download button to access the LS1088ASE7Q1A schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like LS108, or try a keyword search, such as Other uPs/uCs/Peripheral ICs

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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