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LS1088ASN7MQA - NXP

Description: Microprocessors - MPU 1200/1600 ST

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PCB Footprints
LS1088ASN7MQA - NXP PCB footprint - BGA - BGA - SOT1653-1-2022
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3D Models
LS1088ASN7MQA - NXP  - 3D model - BGA - SOT1653-1-2022
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LS1088ASN7MQA Details

  • Manufacturer Part Number:

    LS1088ASN7MQA

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-780

  • ECCN Code:

    5A002.A.1

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    9

  • JESD-30 Code:

    S-PBGA-B780

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    780

  • Operating Temperature-Max:

    105 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA780,28X28,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    250

  • Seated Height-Max:

    2.61 mm

  • Supply Voltage-Max:

    1.055 V

  • Supply Voltage-Min:

    0.995 V

  • Supply Voltage-Nom:

    1.025 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    23 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

LS1088ASN7MQA Frequently Asked Questions (FAQs)

  • The recommended thermal design for the LS1088ASN7MQA involves using a heat sink with a thermal interface material (TIM) to dissipate heat. The heat sink should be designed to keep the junction temperature (TJ) below 105°C.
  • To optimize power consumption on the LS1088ASN7MQA, use the power management features such as dynamic voltage and frequency scaling, clock gating, and power gating. Additionally, use low-power modes like sleep and standby modes when the processor is idle.
  • The maximum frequency for the LS1088ASN7MQA is 1.5 GHz. However, the actual frequency may vary depending on the specific use case and thermal design.
  • To ensure reliable booting on the LS1088ASN7MQA, use a reliable boot source such as a serial flash or a boot ROM. Also, ensure that the boot loader is configured correctly and the boot process is properly sequenced.
  • The recommended PCB design guidelines for the LS1088ASN7MQA include using a 4-layer or 6-layer PCB, following the NXP-provided layout guidelines, and ensuring proper signal integrity and power integrity.

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LS1088ASN7MQA Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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