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LSENC2016KKT1R0M - TAIYO YUDEN

Description: 1 µH Shielded Wirewound Inductor 3.1 A 60mOhm Max 0806 (2016 Metric)

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Symbol
LSENC2016KKT1R0M - TAIYO YUDEN - PCB symbol
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PCB Footprints
LSENC2016KKT1R0M - TAIYO YUDEN PCB footprint - Other - Other - LSENC2016KKT1R0M
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3D Models
LSENC2016KKT1R0M - TAIYO YUDEN - 3D model - Other - LSENC2016KKT1R0M
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LSENC2016KKT1R0M Details

  • Manufacturer Part Number:

    LSENC2016KKT1R0M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    TAIYO YUDEN

  • YTEOL:

    7.4

  • Case/Size Code:

    0806

  • Construction:

    Rectangular

  • Core Material:

    Metal

  • DC Resistance:

    0.06 Ω

  • Inductance-Nom (L):

    1 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    1 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, Embossed, 7 Inch

  • Rated Current-Max:

    3.1 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    ONE SURFACE

  • Test Frequency:

    1 MHz

  • Tolerance:

    20%

LSENC2016KKT1R0M Frequently Asked Questions (FAQs)

  • The recommended land pattern for LSENC2016KKT1R0M is a rectangular pad with a size of 2.5mm x 1.6mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask opening of 2.2mm x 1.3mm.
  • The LSENC2016KKT1R0M is rated for operation up to 125°C, but it's recommended to derate the current rating by 1.5% per degree Celsius above 80°C to ensure reliable operation. Consult the datasheet and application notes for more information.
  • During reflow soldering, ensure that the component is exposed to a maximum temperature of 260°C for no more than 10 seconds. The recommended reflow profile is a peak temperature of 245°C with a ramp-up rate of 3°C/second and a cool-down rate of 6°C/second.
  • Yes, the LSENC2016KKT1R0M is compatible with lead-free soldering. It's designed to withstand the higher temperatures associated with lead-free soldering processes.
  • The LSENC2016KKT1R0M has a moisture sensitivity level (MSL) of 2, which means it can be exposed to a relative humidity of 60% at 30°C for up to 168 hours without being baked.

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LSENC2016KKT1R0M Overview

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