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LSF0102DCUR - Texas Instruments

Description: Dual Bidirectional Multi-Voltage Level Translator

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PCB Footprints
LSF0102DCUR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - VSSOP8
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3D Models
LSF0102DCUR - Texas Instruments  - 3D model - Small Outline Packages - VSSOP8
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LSF0102DCUR Details

  • Manufacturer Part Number:

    LSF0102DCUR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Delay-Max:

    1.2 ns

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    VOLTAGE LEVEL TRANSLATOR

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    2.3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Equivalence Code:

    TSSOP8,.12,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.9 mm

  • Supply Current-Max:

    5 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

LSF0102DCUR Frequently Asked Questions (FAQs)

  • A good PCB layout for LSF0102DCUR involves keeping the input and output traces separate, using a solid ground plane, and minimizing the length of the input traces to reduce noise and EMI.
  • Ensure a stable power supply, use a 0.1uF decoupling capacitor between VCC and GND, and add a 10uF bulk capacitor for each power rail to ensure proper power decoupling.
  • The LSF0102DCUR can support data rates up to 1.5 Gbps, but the actual data rate may vary depending on the system design, PCB layout, and signal integrity.
  • Use oscilloscopes and signal analyzers to measure signal quality, check for impedance mismatches, and verify that the signal is within the specified voltage range to troubleshoot signal integrity issues.
  • The LSF0102DCUR is rated for operation up to 85°C, but it's recommended to derate the device for reliable operation in high-temperature environments. Consult the datasheet for specific derating guidelines.

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LSF0102DCUR Overview

Use the download button to access the LSF0102DCUR schematic symbol, PCB footprint, and 3D model.
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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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