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LSF0102DDFR - Texas Instruments

Description: Translation - Voltage Levels Dual bidirectional multi-voltage level translator

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LSF0102DDFR - Texas Instruments - PCB symbol
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LSF0102DDFR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - LSF0102DDFRaaa
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LSF0102DDFR - Texas Instruments - 3D model - Small Outline Packages - LSF0102DDFRaaa
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LSF0102DDFR Details

  • Manufacturer Part Number:

    LSF0102DDFR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Delay-Max:

    1.2 ns

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    VOLTAGE LEVEL TRANSLATOR

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.1

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    5 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.6 mm

LSF0102DDFR Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a layout with a solid ground plane, short and wide traces for the high-frequency signals, and a decoupling capacitor between VCC and GND. A 4-layer PCB with a dedicated power plane is also recommended.
  • To ensure signal integrity, use controlled impedance traces, minimize trace length and stubs, and use a common mode filter or a ferrite bead to reduce EMI. Also, keep the signal traces away from the power plane and use a shielded cable for the USB interface.
  • The maximum cable length supported by LSF0102DDFR is 3 meters for a standard USB 2.0 cable. However, this can be extended up to 5 meters using an active repeater or a USB 3.0 cable.
  • To handle hot-swapping, use a power switch or a reset circuit to ensure that the device is properly powered down before disconnecting. Also, use a capacitor to filter the power supply and prevent voltage spikes during hot-swapping.
  • The LSF0102DDFR has an ESD protection level of ±8 kV contact discharge and ±15 kV air gap discharge, which meets the IEC 61000-4-2 standard.

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LSF0102DDFR Overview

Use the download button to access the LSF0102DDFR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like LSF01, or try a keyword search, such as Level Translators

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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