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LSF0102QDCURQ1 - Texas Instruments

Description: Automotive Dual-Channel Bidirectional Multi-Voltage Level Translator

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LSF0102QDCURQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - VSSOP8
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LSF0102QDCURQ1 - Texas Instruments  - 3D model - Small Outline Packages - VSSOP8
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LSF0102QDCURQ1 Details

  • Manufacturer Part Number:

    LSF0102QDCURQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2018-05-13

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    IT REQUIRES I/O VOLTAGE-MAX 5V

  • Delay-Max:

    1.2 ns

  • Interface IC Type:

    VOLTAGE LEVEL TRANSLATOR

  • Interface Standard:

    GENERAL PURPOSE

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    2.3 mm

  • Moisture Sensitivity Level:

    2

  • Number of Bits:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Equivalence Code:

    TSSOP8,.12,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.9 mm

  • Supply Current-Max:

    5.5 mA

  • Supply Voltage-Max:

    4.9 V

  • Supply Voltage-Min:

    0.9 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

LSF0102QDCURQ1 Frequently Asked Questions (FAQs)

  • A good PCB layout for LSF0102QDCURQ1 involves keeping the input and output traces short and wide, using a solid ground plane, and placing decoupling capacitors close to the device. TI provides a recommended layout in the datasheet and application notes.
  • To ensure signal integrity, use controlled impedance traces, minimize trace length and stubs, and use termination resistors if necessary. Also, ensure that the signal frequency is within the device's bandwidth and that the signal amplitude is within the recommended range.
  • The maximum operating temperature range for LSF0102QDCURQ1 is -40°C to 125°C. However, the device's performance may degrade at extreme temperatures, so it's essential to consider thermal management in the system design.
  • Yes, LSF0102QDCURQ1 is a high-reliability device suitable for use in automotive, industrial, and other high-reliability applications. It meets the requirements of AEC-Q100 and is manufactured using a robust process.
  • To troubleshoot issues with LSF0102QDCURQ1, start by checking the power supply voltage, signal integrity, and PCB layout. Use oscilloscopes and logic analyzers to debug the signal. Consult the datasheet and application notes for troubleshooting guidelines.

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LSF0102QDCURQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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