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LSF0204DRGYR - Texas Instruments

Description: Voltage Level Translator Bidirectional 1 Circuit 4 Channel 100MHz 14-VQFN (3.5x3.5), IC TRNSLTR BIDIRECTIONAL 14VQFN

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LSF0204DRGYR - Texas Instruments - PCB symbol
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PCB Footprints
LSF0204DRGYR - Texas Instruments PCB footprint - Other - Other - LSF0204DRGYR
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3D Models
LSF0204DRGYR - Texas Instruments - 3D model - Other - LSF0204DRGYR
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LSF0204DRGYR Details

  • Manufacturer Part Number:

    LSF0204DRGYR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Pin Count:

    14

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Delay-Max:

    45 ns

  • Interface IC Type:

    VOLTAGE LEVEL TRANSLATOR

  • JESD-30 Code:

    S-PQCC-N14

  • JESD-609 Code:

    e4

  • Length:

    3.5 mm

  • Moisture Sensitivity Level:

    2

  • Number of Bits:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC14/18,.14SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    0.0125 mA

  • Supply Voltage-Max:

    4.5 V

  • Supply Voltage-Min:

    0.8 V

  • Supply Voltage-Nom:

    1.2 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    1.8 V

  • Supply Voltage1-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.5 mm

LSF0204DRGYR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines, and to ensure that the device is operated within its specified temperature range. Additionally, consider using thermal interface materials and heat sinks to improve heat dissipation.
  • Exceeding the maximum junction temperature can lead to reduced device lifespan, decreased performance, and potentially even device failure. It's essential to ensure that the device operates within its specified temperature range to maintain reliability and performance.
  • To handle ESD protection for the LSF0204DRGYR, follow proper ESD handling procedures during device handling and assembly, and consider using ESD protection devices or circuits in the system design.
  • The recommended soldering conditions for the LSF0204DRGYR involve using a soldering iron with a temperature of 260°C (500°F) or less, and a soldering time of 3 seconds or less. It's also essential to follow proper soldering techniques and use a solder with a melting point below 220°C (428°F).

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LSF0204DRGYR Overview

Use the download button to access the LSF0204DRGYR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like LSF02, or try a keyword search, such as Level Translators

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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