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LSF0204DRUTR - Texas Instruments

Description: 4-Bit Bidirectional Multi-Voltage Level Translator for Open-Drain & Push-Pull

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PCB Footprints
LSF0204DRUTR - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 12 QFN
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3D Models
LSF0204DRUTR - Texas Instruments  - 3D model - Quad Flat No-Lead - 12 QFN
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LSF0204DRUTR Details

  • Manufacturer Part Number:

    LSF0204DRUTR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Pin Count:

    12

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Delay-Max:

    45 ns

  • Interface IC Type:

    VOLTAGE LEVEL TRANSLATOR

  • JESD-30 Code:

    R-PQCC-N12

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VQCCN

  • Package Equivalence Code:

    LCC12,.07X.08,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.55 mm

  • Supply Current-Max:

    0.0125 mA

  • Supply Voltage-Max:

    4.5 V

  • Supply Voltage-Min:

    0.8 V

  • Supply Voltage-Nom:

    1.2 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    1.8 V

  • Supply Voltage1-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.7 mm

LSF0204DRUTR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and ensure that the PCB is designed to minimize thermal resistance.
  • To ensure reliable operation at high temperatures, ensure that the device is operated within the recommended temperature range (–40°C to 125°C). Use a heat sink or thermal pad to dissipate heat, and avoid exceeding the maximum junction temperature (150°C). Also, ensure that the PCB is designed to minimize thermal resistance and that the device is properly soldered.
  • To minimize EMI and RFI, use a shielded enclosure or a metal can package. Ensure that the PCB is designed with EMI and RFI in mind, using techniques such as grounding, shielding, and filtering. Also, use a common-mode choke or a ferrite bead to filter out high-frequency noise.
  • To ensure proper power sequencing and startup, ensure that the input voltage (VIN) is applied before the enable signal (EN). Use a soft-start circuit or a voltage supervisor to ensure that the device is powered up correctly. Also, ensure that the input voltage is within the recommended range (2.7V to 5.5V).
  • To ensure reliable PCB assembly and rework, use a reflow soldering process with a peak temperature of 260°C. Avoid using wave soldering or hand soldering, as they can damage the device. Use a soldering iron with a temperature-controlled tip, and avoid applying excessive heat or force during rework.

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LSF0204DRUTR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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