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LSF0204DYZPR - Texas Instruments

Description: 4-Bit Bidirectional Multi-Voltage Level Translator for Open-Drain & Push-Pull

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PCB Footprints
LSF0204DYZPR - Texas Instruments PCB footprint - BGA - BGA - YZP0012-C01 DSBGA - 0.5 mm max height
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3D Models
LSF0204DYZPR - Texas Instruments  - 3D model - BGA - YZP0012-C01 DSBGA - 0.5 mm max height
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LSF0204DYZPR Details

  • Manufacturer Part Number:

    LSF0204DYZPR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Pin Count:

    12

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Delay-Max:

    45 ns

  • Interface IC Type:

    VOLTAGE LEVEL TRANSLATOR

  • JESD-30 Code:

    R-XBGA-B12

  • JESD-609 Code:

    e1

  • Length:

    1.942 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Polarity:

    TRUE

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA12,3X4,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.5 mm

  • Supply Current-Max:

    0.0125 mA

  • Supply Voltage-Max:

    4.5 V

  • Supply Voltage-Min:

    0.8 V

  • Supply Voltage-Nom:

    1.2 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    1.8 V

  • Supply Voltage1-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.442 mm

LSF0204DYZPR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good PCB design practices, such as using a solid ground plane, minimizing trace lengths, and avoiding vias under the device. Additionally, ensure that the input and output traces are separated to prevent noise coupling.
  • The LSF0204DYZPR has a thermal pad on the bottom, which should be connected to a solid ground plane or a thermal relief pattern on the PCB. Ensure good airflow around the device, and consider using a heat sink or thermal interface material if the device will be operating in high-temperature environments.
  • While the datasheet specifies a maximum operating frequency of 100 MHz, the actual frequency limit depends on the specific application, PCB layout, and signal integrity. In general, it's recommended to derate the frequency by 10-20% to ensure reliable operation.
  • To ensure signal integrity, use controlled impedance traces, minimize trace lengths, and avoid sharp corners or bends. Additionally, use termination resistors or series resistors to match the impedance of the signal lines, and consider using a signal integrity analysis tool to simulate and optimize the design.
  • Texas Instruments recommends using a 10 uF ceramic capacitor in parallel with a 100 nF ceramic capacitor, both with a voltage rating of 10 V or higher, as close to the device as possible. This helps to filter out noise and ensure stable operation.

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LSF0204DYZPR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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