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LSF0204RGYR - Texas Instruments

Description: Voltage Level Translator 4-CH Bidirectional Automotive 14-Pin VQFN EP T/R

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PCB Footprints
LSF0204RGYR - Texas Instruments PCB footprint - Other - Other - LSF0204RGYR-2
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3D Models
LSF0204RGYR - Texas Instruments  - 3D model - Other - LSF0204RGYR-2
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LSF0204RGYR Details

  • Manufacturer Part Number:

    LSF0204RGYR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Delay-Max:

    6.7 ns

  • Interface IC Type:

    VOLTAGE LEVEL TRANSLATOR

  • JESD-30 Code:

    S-PQCC-N14

  • JESD-609 Code:

    e4

  • Length:

    3.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC14/18,.14SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    0.004 mA

  • Supply Voltage-Max:

    4.5 V

  • Supply Voltage-Min:

    0.8 V

  • Supply Voltage-Nom:

    1.2 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    1.8 V

  • Supply Voltage1-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.5 mm

LSF0204RGYR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and keep the thermal pad clear of solder mask.
  • To ensure reliable operation at high temperatures, ensure that the device is operated within the recommended temperature range (–40°C to 125°C). Use a heat sink or thermal pad to dissipate heat, and avoid overheating the device. Also, ensure that the PCB is designed to withstand high temperatures, and that the components are rated for high-temperature operation.
  • When handling the device, take precautions to prevent electrostatic discharge (ESD) damage. Use an ESD wrist strap or mat, and handle the device by the body or pins, not the leads. Avoid touching the device's leads or pins, and store the device in an anti-static bag or container.
  • To troubleshoot issues with the device, start by checking the power supply voltage and ensuring that it is within the recommended range. Check for proper PCB layout and thermal design. Use a logic analyzer or oscilloscope to verify the input and output signals. Consult the datasheet and application notes for troubleshooting guidelines.
  • When assembling the device onto a PCB, ensure that the PCB is clean and free of contaminants. Use a soldering iron with a temperature range of 250°C to 300°C, and avoid overheating the device. For rework, use a hot air rework station or a soldering iron with a fine tip, and avoid applying excessive heat or force.

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LSF0204RGYR Overview

Use the download button to access the LSF0204RGYR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like LSF02, or try a keyword search, such as Level Translators

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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