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LSIC1MO120E0160 - LITTELFUSE

Description: LITTELFUSE - LSIC1MO120E0160 - Power MOSFET, N Channel, 1.2 kV, 14 A, 0.16 ohm, TO-247, Through Hole

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Symbol
LSIC1MO120E0160 - LITTELFUSE - PCB symbol
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PCB Footprints
LSIC1MO120E0160 - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - To-247-3L_LF_SICMOSFET
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3D Models
LSIC1MO120E0160 - LITTELFUSE - 3D model - Transistor Outline, Vertical - To-247-3L_LF_SICMOSFET
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LSIC1MO120E0160 Details

  • Manufacturer Part Number:

    LSIC1MO120E0160

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    0

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    1200 V

  • Drain Current-Max (ID):

    20 A

  • Drain-source On Resistance-Max:

    0.2 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    5 pF

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    125 W

  • Pulsed Drain Current-Max (IDM):

    45 A

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON CARBIDE

LSIC1MO120E0160 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for LSIC1MO120E0160 is a rectangular pad with dimensions of 1.5mm x 0.8mm, with a 0.5mm radius corner. The pad should be centered on the component and have a solder mask defined gap of 0.2mm.
  • To ensure reliable soldering of LSIC1MO120E0160, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the PCB pad. Use a soldering technique that minimizes the risk of overheating the component.
  • The maximum operating temperature range for LSIC1MO120E0160 is -40°C to 150°C. However, it's recommended to operate the device within a temperature range of -20°C to 125°C for optimal performance and reliability.
  • Yes, LSIC1MO120E0160 is designed to withstand high-vibration environments. However, it's recommended to follow proper mounting and soldering techniques to ensure the component remains securely attached to the PCB.
  • To prevent electrostatic discharge (ESD) damage, handle LSIC1MO120E0160 with ESD-protective equipment, such as wrist straps, mats, and bags. Ensure that the workspace and personnel are grounded to prevent static electricity buildup.

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LSIC1MO120E0160 Overview

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