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LSP5523-R8A - Diodes Incorporated

Description: Switching Voltage Regulators DCDC Conv HV Buck SO-8EP T&R 2.5K

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LSP5523-R8A - Diodes Incorporated PCB footprint - Small Outline Packages - Small Outline Packages - 8-MSOP (U)
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LSP5523-R8A - Diodes Incorporated  - 3D model - Small Outline Packages - 8-MSOP (U)
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LSP5523-R8A Details

  • Manufacturer Part Number:

    LSP5523-R8A

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ESOP-8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Input Voltage-Max:

    27 V

  • Input Voltage-Min:

    4.5 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -20 °C

  • Output Current-Max:

    3 A

  • Output Voltage-Max:

    21.6 V

  • Output Voltage-Min:

    0.925 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLSOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.7 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    380 kHz

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

LSP5523-R8A Frequently Asked Questions (FAQs)

  • A thermal pad is recommended to be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended for optimal thermal performance.
  • The device is sensitive to temperature and humidity. Ensure that the PCB is baked at 125°C for 24 hours before soldering, and use a soldering iron with a temperature not exceeding 260°C for 10 seconds.
  • A 10uF ceramic capacitor with an X7R or X5R dielectric is recommended for input decoupling. The capacitor should be placed as close to the VIN pin as possible.
  • Ensure that the device is not exposed to voltage exceeding the maximum rating. Use a TVS diode or a zener diode to clamp the input voltage to prevent EOS damage.
  • A 22uF ceramic capacitor with an X7R or X5R dielectric is recommended for output filtering. The capacitor should be placed as close to the VOUT pin as possible.

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LSP5523-R8A Overview

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