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LSP5526-S8A - Lite-On

Description: IC-5526 DC-DC CONVERTER SO8

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LSP5526-S8A - Lite-On - PCB symbol
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PCB Footprints
LSP5526-S8A - Lite-On PCB footprint - Small Outline Packages - Small Outline Packages - SOP-8L
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3D Models
LSP5526-S8A - Lite-On - 3D model - Small Outline Packages - SOP-8L
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LSP5526-S8A Details

  • Manufacturer Part Number:

    LSP5526-S8A

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    SOP-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Lite-On Semiconductor Corporation

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Input Voltage-Max:

    23 V

  • Input Voltage-Min:

    4.5 V

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -20 °C

  • Output Current-Max:

    2 A

  • Output Voltage-Max:

    18 V

  • Output Voltage-Min:

    0.925 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    1.5 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    340 kHz

  • Temperature Grade:

    OTHER

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    3.9 mm

LSP5526-S8A Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current ranges, and that the PCB is designed to minimize thermal resistance. Also, consider using thermal protection circuits or thermal sensors to prevent overheating.
  • Exceeding the maximum Tj rating can lead to reduced lifespan, decreased performance, and potentially catastrophic failure. Ensure that the device is operated within the recommended temperature range to prevent overheating.
  • Implement ESD protection measures such as using ESD-resistant components, adding ESD protection diodes, and following proper handling and storage procedures to prevent damage from electrostatic discharge.
  • Follow the recommended soldering temperature profile: 240°C for 10-15 seconds, with a peak temperature of 260°C. Ensure that the soldering process is done in a controlled environment to prevent damage to the device.

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LSP5526-S8A Overview

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