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LT1027DCLS8-5#PBF - Analog Devices

Description: Series Voltage Reference IC Fixed 5V V ±0.1% 15 mA 8-CLCC (5x5)

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LT1027DCLS8-5#PBF - Analog Devices - PCB symbol
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PCB Footprints
LT1027DCLS8-5#PBF - Analog Devices PCB footprint - Other - Other - LS8 Package 8-Pin Leadless Chip Carrier (5mm × 5mm)_2023
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3D Models
LT1027DCLS8-5#PBF - Analog Devices - 3D model - Other - LS8 Package 8-Pin Leadless Chip Carrier (5mm × 5mm)_2023
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LT1027DCLS8-5#PBF Details

  • Manufacturer Part Number:

    LT1027DCLS8-5#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LCC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    05-08-1852

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog IC - Other Type:

    THREE TERMINAL VOLTAGE REFERENCE

  • JESD-30 Code:

    S-CQCC-N8

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Output Voltage-Max:

    5.005 V

  • Output Voltage-Min:

    4.995 V

  • Output Voltage-Nom:

    5 V

  • Package Body Material:

    CERAMIC, METAL-SEALED COFIRED

  • Package Code:

    HQCCN

  • Package Equivalence Code:

    LCC8,.2SQ

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.55 mm

  • Supply Voltage-Max (Vsup):

    40 V

  • Supply Voltage-Min (Vsup):

    8 V

  • Supply Voltage-Nom (Vsup):

    10 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temp Coef of Voltage-Max:

    5 ppm/°C

  • Temperature Grade:

    COMMERCIAL

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trim/Adjustable Output:

    YES

  • Width:

    5 mm

LT1027DCLS8-5#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT1027 involves keeping the input and output traces short and separate, using a solid ground plane, and placing the bypass capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure stability, make sure to follow the recommended compensation network, use a minimum output capacitance of 10uF, and keep the input and output impedance low. Also, avoid using long input traces and keep the device away from noise sources.
  • The maximum power dissipation of the LT1027 is dependent on the package and the ambient temperature. For the DCLS8 package, the maximum power dissipation is 1.4W at 25°C ambient temperature. However, it's recommended to derate the power dissipation based on the ambient temperature and the thermal resistance of the package.
  • The LT1027 is not recommended for high-current applications. It's designed for low-power, low-noise applications and can only deliver up to 10mA of output current. For high-current applications, consider using a dedicated voltage regulator IC or a switching regulator.
  • To protect the LT1027 from input voltage transients and surges, consider adding a TVS (Transient Voltage Suppressor) diode or a voltage clamp at the input. Also, make sure to follow proper PCB layout practices and use a sufficient input capacitor to filter out noise and transients.

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LT1027DCLS8-5#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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