LT1102CN8#PBF footprint, schematic symbol and 3D model by Analog Devices

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LT1102CN8#PBF - Analog Devices PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - LT1102CN8#PBF

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Datasheet Download Datasheet
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Part Number LT1102CN8#PBF
Manufacturer Analog Devices
Pin Count 8
Part Category Integrated Circuit
Package Category Ceramic Dual-In-Line Packages
Footprint Name Ceramic Dual-In-Line Packages - LT1102CN8#PBF
Released Date Jun 12, 2019
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

LT1102CN8#PBF Details

Manufacturer Part Number:
LT1102CN8#PBF
Brand Name:
Analog Devices Inc
Pbfree Code:
No
Rohs Code:
Yes
Part Life Cycle Code:
Active
Package Description:
0.300 INCH, LEAD FREE, PLASTIC, DIP-8
Pin Count:
8
Manufacturer Package Code:
05-08-1510 (N8)
Country Of Origin:
Malaysia
ECCN Code:
EAR99
HTS Code:
8542.33.00.01
Manufacturer:
Analog Devices Inc
YTEOL:
9
Amplifier Type:
INSTRUMENTATION AMPLIFIER
Average Bias Current-Max (IIB):
0.0004 µA
Bandwidth (3dB)-Nom:
3.5 MHz
Common-mode Reject Ratio-Min:
81 dB
Input Offset Current-Max (IIO):
0.00022 µA
Input Offset Voltage-Max:
1400 µV
JESD-30 Code:
R-PDIP-T8
JESD-609 Code:
e3
Length:
10.62 mm
Moisture Sensitivity Level:
1
Neg Supply Voltage Limit-Max:
-20 V
Neg Supply Voltage-Nom (Vsup):
-15 V
Non-linearity-Max:
0.0048%
Number of Functions:
1
Number of Terminals:
8
Operating Temperature-Max:
70 °C
Package Body Material:
PLASTIC/EPOXY
Package Code:
DIP
Package Shape:
RECTANGULAR
Package Style:
IN-LINE
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Seated Height-Max:
3.937 mm
Slew Rate-Nom:
17 V/us
Supply Current-Max:
2.5 mA
Supply Voltage Limit-Max:
20 V
Supply Voltage-Nom (Vsup):
15 V
Surface Mount:
NO
Technology:
BIPOLAR
Temperature Grade:
COMMERCIAL
Terminal Finish:
Matte Tin (Sn)
Terminal Form:
THROUGH-HOLE
Terminal Pitch:
2.54 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Voltage Gain-Max:
100
Voltage Gain-Min:
10
Width:
7.62 mm

LT1102CN8#PBF Frequently Asked Questions (FAQs)

A good PCB layout for the LT1102CN8 involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing bypass capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
To ensure stability, make sure to follow the recommended component values and layout guidelines in the datasheet. Additionally, ensure that the output capacitor is of sufficient size and has a low ESR, and that the input capacitor is properly bypassed. Also, avoid using long input traces and keep the feedback loop as short as possible.
The LT1102CN8 can operate in ambient temperatures up to 70°C, but the junction temperature should not exceed 150°C. It's essential to ensure proper heat sinking and thermal management to prevent overheating.
Yes, the LT1102CN8 can be used in switching regulator designs, but it's essential to ensure that the device is properly bypassed and that the input and output capacitors are of sufficient size and have low ESR. Additionally, the device's switching frequency should be limited to 100 kHz or less to prevent excessive power loss.
To troubleshoot issues with the LT1102CN8, start by checking the input and output voltages, and ensure that the device is properly powered and biased. Check for oscillations, excessive heat, or unusual current consumption. Use an oscilloscope to examine the waveforms and identify any anomalies. Consult the datasheet and application notes for guidance on troubleshooting common issues.

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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