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LT1370CT7#PBF - Analog Devices

Description: SWITCHING REG 6A, TO-220-7, 1370

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LT1370CT7#PBF - Analog Devices - PCB symbol
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LT1370CT7#PBF - Analog Devices PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - 7-Lead Plastic TO-220 (Standard)
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LT1370CT7#PBF - Analog Devices - 3D model - Transistor Outline, Vertical - 7-Lead Plastic TO-220 (Standard)
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LT1370CT7#PBF Details

  • Manufacturer Part Number:

    LT1370CT7#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LEAD FREE, PLASTIC, TO-220, 7 PIN

  • Pin Count:

    7

  • Manufacturer Package Code:

    05-08-1422 (STD)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    25 V

  • Input Voltage-Min:

    2.7 V

  • Input Voltage-Nom:

    5 V

  • JESD-30 Code:

    R-PZFM-T7

  • JESD-609 Code:

    e3

  • Length:

    10.22 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    7

  • Operating Temperature-Max:

    70 °C

  • Output Current-Max:

    10 A

  • Output Voltage-Nom:

    1.245 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TO-220

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    21.53 mm

  • Supply Current-Max (Isup):

    6 mA

  • Surface Mount:

    NO

  • Switcher Configuration:

    BOOST

  • Switching Frequency-Max:

    580 kHz

  • Technology:

    BIPOLAR

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    ZIG-ZAG

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.38 mm

LT1370CT7#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT1370CT7 involves keeping the input and output traces short and separate, using a solid ground plane, and placing the input and output capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure stability, it's essential to follow the recommended layout and component placement guidelines, use a sufficient output capacitor, and ensure that the input and output impedance are matched. Additionally, adding a small resistor (e.g., 10Ω) in series with the output capacitor can help prevent oscillations.
  • The maximum input voltage of the LT1370CT7 is 15V, but it's recommended to keep the input voltage below 12V to ensure reliable operation and prevent damage to the device.
  • The LT1370CT7 is rated for operation up to 125°C, but its performance may degrade at high temperatures. It's essential to consider the device's thermal characteristics and ensure proper heat sinking and cooling in high-temperature applications.
  • The output capacitor should be selected based on the desired output voltage ripple, output current, and operating frequency. A general rule of thumb is to use a capacitor with a value of at least 10μF and a voltage rating of at least 2x the output voltage. X5R or X7R ceramic capacitors are recommended for their low ESR and high reliability.

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LT1370CT7#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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