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LT1460HCS3-5#TRMPBF - Analog Devices

Description: Linear Technology LT1460HCS3-5#TRMPBF, Series Precision Voltage Reference, Maximum of 5 V, 0.2% 30 V max., 3-Pin SOIC

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PCB Footprints
LT1460HCS3-5#TRMPBF - Analog Devices PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - S3 Package 3-Lead Plastic SOT-23 height 1.12
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LT1460HCS3-5#TRMPBF Details

  • Manufacturer Part Number:

    LT1460HCS3-5#TRMPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    PLASTIC, TO-236AB, SOT-23, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    05-08-1631

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog IC - Other Type:

    THREE TERMINAL VOLTAGE REFERENCE

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Length:

    2.92 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Max:

    5.01 V

  • Output Voltage-Min:

    4.99 V

  • Output Voltage-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TO-236

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.12 mm

  • Supply Voltage-Max (Vsup):

    20 V

  • Supply Voltage-Min (Vsup):

    5.9 V

  • Supply Voltage-Nom (Vsup):

    7.5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temp Coef of Voltage-Max:

    20 ppm/°C

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.96 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trim/Adjustable Output:

    NO

  • Width:

    1.3 mm

LT1460HCS3-5#TRMPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT1460HCS3-5 involves keeping the input and output traces short and separate, using a solid ground plane, and placing the bypass capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Also, ensure that the output capacitor is of high quality and has a low equivalent series resistance (ESR). Additionally, the input capacitor should be placed close to the device and have a low ESR.
  • The maximum ambient temperature range for the LT1460HCS3-5 is -40°C to 125°C. However, the device can operate at a junction temperature of up to 150°C.
  • Yes, the LT1460HCS3-5 is suitable for high-reliability applications. It is manufactured using a high-reliability process and is screened to ensure high performance and reliability. However, it is essential to follow proper design and manufacturing practices to ensure the reliability of the final product.
  • To troubleshoot issues with the LT1460HCS3-5, start by checking the input voltage, output voltage, and current. Verify that the device is properly soldered and that the PCB layout is correct. Check for any signs of overheating, and ensure that the device is operated within its recommended specifications.

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LT1460HCS3-5#TRMPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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