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LT1461ACS8-5#PBF - Analog Devices

Description: LINEAR TECHNOLOGY - LT1461ACS8-5#PBF - VOLTAGE REF, SERIES, 5V, NSOIC-8

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LT1461ACS8-5#PBF - Analog Devices - PCB symbol
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LT1461ACS8-5#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - S8(SOIC)
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LT1461ACS8-5#PBF - Analog Devices - 3D model - Small Outline Packages - S8(SOIC)
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LT1461ACS8-5#PBF Details

  • Manufacturer Part Number:

    LT1461ACS8-5#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SO-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    05-08-1610 (S8)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog IC - Other Type:

    THREE TERMINAL VOLTAGE REFERENCE

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Output Voltage-Max:

    5.002 V

  • Output Voltage-Min:

    4.998 V

  • Output Voltage-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    20 V

  • Supply Voltage-Min (Vsup):

    5.5 V

  • Supply Voltage-Nom (Vsup):

    7.5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temp Coef of Voltage-Max:

    3 ppm/°C

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trim/Adjustable Output:

    NO

  • Width:

    3.9 mm

LT1461ACS8-5#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT1461ACS8-5 involves keeping the input and output traces short and separate, using a solid ground plane, and placing the bypass capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure stability, make sure to follow the recommended compensation network, use a minimum output capacitance of 10uF, and keep the input and output impedance ratios within the recommended range. Also, avoid using long input traces and minimize the distance between the device and the output capacitor.
  • The maximum power dissipation of the LT1461ACS8-5 is 1.4W. However, this can be affected by the ambient temperature, PCB layout, and airflow. It's essential to calculate the power dissipation based on the specific application and ensure that it's within the recommended limits.
  • The LT1461ACS8-5 is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's essential to consider the thermal management and ensure that the device is operated within the recommended temperature range.
  • To protect the LT1461ACS8-5 from overvoltage and undervoltage conditions, use a voltage regulator with overvoltage protection (OVP) and undervoltage protection (UVP) features. Additionally, consider adding external protection devices such as TVS diodes or zener diodes to absorb voltage transients.

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LT1461ACS8-5#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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