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LT1641-1IS8#PBF - Analog Devices

Description: Linear Technology LT1641-1IS8#PBF, Hot Swap Controller, 80 (Max.) V, 8-Pin, SOIC

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LT1641-1IS8#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 8-Lead Plastic Small Outline (Narrow .150 Inch)
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LT1641-1IS8#PBF - Analog Devices  - 3D model - Small Outline Packages - 8-Lead Plastic Small Outline (Narrow .150 Inch)
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LT1641-1IS8#PBF Details

  • Manufacturer Part Number:

    LT1641-1IS8#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    0.150 INCH, LEAD FREE, PLASTIC, SOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    05-08-1610 (S8)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Additional Feature:

    UNDERVOLTAGE LOCKOUT; OVERVOLTAGE PROTECTION

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    HOT SWAP CONTROLLER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9025 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.752 mm

  • Supply Voltage-Max (Vsup):

    80 V

  • Supply Voltage-Min (Vsup):

    9 V

  • Supply Voltage-Nom (Vsup):

    24 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.899 mm

LT1641-1IS8#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT1641-1IS8 involves keeping the input and output traces short and wide, using a solid ground plane, and placing the input and output capacitors close to the device. Additionally, it's recommended to use a low-ESR capacitor for the output capacitor to minimize ringing.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Also, ensure that the output capacitor has a low ESR and is properly sized for the output current. Additionally, consider adding a small capacitor (e.g., 10nF) between the VIN and GND pins to improve stability.
  • The maximum ambient temperature range for the LT1641-1IS8 is -40°C to 125°C. However, the device's performance may degrade at higher temperatures, so it's essential to consider thermal management in your design.
  • Yes, the LT1641-1IS8 is suitable for high-reliability and automotive applications. It's AEC-Q100 qualified and meets the requirements for automotive systems. However, it's essential to follow the recommended design guidelines and testing procedures to ensure the device meets the specific requirements of your application.
  • The output voltage of the LT1641-1IS8 can be calculated using the following formula: VOUT = (VIN x R1) / (R1 + R2), where R1 and R2 are the resistors in the feedback network. Make sure to choose the correct resistor values to achieve the desired output voltage.

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LT1641-1IS8#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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