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LT1737IS#PBF - Analog Devices

Description: IC REG CTRLR FLYBACK 16SOIC

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LT1737IS#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 16-Lead Plastic Small Outline (Narrow 0.150)
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LT1737IS#PBF - Analog Devices  - 3D model - Small Outline Packages - 16-Lead Plastic Small Outline (Narrow 0.150)
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LT1737IS#PBF Details

  • Manufacturer Part Number:

    LT1737IS#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    0.150 INCH, PLASTIC, SO-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    05-08-1610 (S16)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    20 V

  • Input Voltage-Min:

    4.5 V

  • Input Voltage-Nom:

    14 V

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    9.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    15 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    SINGLE

  • Switching Frequency-Max:

    250 kHz

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

LT1737IS#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT1737IS#PBF involves keeping the input and output traces separate, using a solid ground plane, and placing the input and output capacitors close to the device. Additionally, it's recommended to use a low-ESR capacitor for the output capacitor to minimize ringing.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Additionally, ensure that the output capacitor is properly sized and has a low ESR. It's also important to decouple the input and output pins with capacitors to prevent oscillation.
  • The maximum input voltage for the LT1737IS#PBF is 15V. Exceeding this voltage can cause damage to the device. It's recommended to use a voltage regulator or other protection circuitry to ensure the input voltage remains within the recommended range.
  • The LT1737IS#PBF is rated for operation up to 125°C. However, it's recommended to derate the device's performance at high temperatures. Consult the datasheet for specific derating guidelines and ensure proper thermal management to prevent overheating.
  • To troubleshoot issues with the LT1737IS#PBF, start by verifying the input voltage and current, and checking for proper component values and PCB layout. Use an oscilloscope to measure the output voltage and current, and check for signs of oscillation or instability. Consult the datasheet and application notes for guidance on troubleshooting and debugging.

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LT1737IS#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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