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LT1962EMS8-3#PBF - Analog Devices

Description: Linear Technology LT1962EMS8-3#PBF, LDO Voltage Regulator, 300mA, 3 V, 1.8 → 20 Vin, 8-Pin

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LT1962EMS8-3#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MS8 Package 8-Lead Plastic MSOP-+-
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LT1962EMS8-3#PBF Details

  • Manufacturer Part Number:

    LT1962EMS8-3#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    PLASTIC, MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    05-08-1660

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.43 V

  • Dropout Voltage1-Nom:

    0.27 V

  • Input Voltage Absolute-Max:

    20 V

  • Input Voltage-Max:

    20 V

  • Input Voltage-Min:

    3.5 V

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Line Regulation-Max:

    0.005%

  • Load Regulation-Max(%):

    0.03%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.3 A

  • Output Voltage1-Max:

    3.075 V

  • Output Voltage1-Min:

    2.925 V

  • Output Voltage1-Nom:

    3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    2.5%

  • Width:

    3 mm

LT1962EMS8-3#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT1962EMS8-3#PBF should include a solid ground plane, a small thermal relief pattern under the package, and a minimal number of thermal vias to reduce thermal resistance. A 2-layer or 4-layer board with a thermal relief pattern is recommended.
  • To ensure a stable and accurate output voltage, make sure to decouple the input and output with ceramic capacitors, use a low-ESR output capacitor, and minimize the distance between the regulator and the capacitors. Also, ensure the input voltage is within the recommended range.
  • The maximum ambient temperature for reliable operation of the LT1962EMS8-3#PBF is 85°C. However, the device can operate up to 125°C with derating. It's essential to consider the thermal design and heat sinking to ensure reliable operation.
  • Yes, the LT1962EMS8-3#PBF is suitable for high-reliability and automotive applications. It meets the requirements of AEC-Q100 and is manufactured with a high-reliability process. However, it's essential to follow the recommended design and layout guidelines to ensure reliable operation.
  • To protect the LT1962EMS8-3#PBF from overvoltage and overcurrent, use a voltage clamp or a transient voltage suppressor (TVS) at the input, and consider adding overcurrent protection using a fuse or a current-limiting resistor.

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LT1962EMS8-3#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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