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LT3042IMSE#TRPBF - Analog Devices

Description: 20V, 200mA, Ultralow Noise, Ultrahigh PSRR RF Linear Regulator

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PCB Footprints
LT3042IMSE#TRPBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MSE Package 10-Lead Plastic MSOP, Exposed Die Pad (Reference LTC DWG # 05-08-1664 Rev I)
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3D Models
LT3042IMSE#TRPBF - Analog Devices  - 3D model - Small Outline Packages - MSE Package 10-Lead Plastic MSOP, Exposed Die Pad (Reference LTC DWG # 05-08-1664 Rev I)
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LT3042IMSE#TRPBF Details

  • Manufacturer Part Number:

    LT3042IMSE#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MSOP-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    05-08-1664

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Adjustability:

    ADJUSTABLE

  • Dropout Voltage1-Max:

    0.3 V

  • Dropout Voltage1-Nom:

    0.22 V

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Load Regulation-Max(%):

    0.003%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    10

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.2 A

  • Output Voltage1-Max:

    15 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Regulator Type:

    ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    3 mm

LT3042IMSE#TRPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT3042 involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the input and output traces. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure stability, it's essential to follow the recommended PCB layout, use the correct output capacitor type and value, and add a compensation capacitor (CFF) between the VFB pin and the output voltage. Additionally, ensure that the input voltage is within the recommended range, and the output current is within the specified limits.
  • The maximum output current capability of the LT3042 is 2A, but it can be limited by the thermal performance of the package and the PCB. It's essential to ensure proper thermal management and heat sinking to achieve the maximum output current.
  • The LT3042 is rated for operation up to 125°C, but its performance may degrade at high temperatures. It's essential to consider the thermal derating of the device and ensure proper heat sinking to maintain reliability and performance in high-temperature environments.
  • The output capacitor should be selected based on the output voltage, output current, and desired ripple voltage. A low-ESR capacitor with a value between 10uF to 100uF is recommended. The capacitor should also be rated for the maximum output voltage and have a low equivalent series resistance (ESR) to minimize voltage ripple.

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LT3042IMSE#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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