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LT3050MPMSE-3.3#PBF - Analog Devices

Description: LDO Voltage Regulators 100mA, Low Noise Linear Regulator with Precision Current Limit and Diagnostic Functions

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LT3050MPMSE-3.3#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MSE Package 12-Lead Plastic MSOP
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LT3050MPMSE-3.3#PBF Details

  • Manufacturer Part Number:

    LT3050MPMSE-3.3#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LEAD FREE, PLASTIC, MSOP-12

  • Pin Count:

    12

  • Manufacturer Package Code:

    05-08-1666

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.55 V

  • Dropout Voltage1-Nom:

    0.34 V

  • Input Voltage Absolute-Max:

    50 V

  • Input Voltage-Max:

    45 V

  • Input Voltage-Min:

    1.6 V

  • JESD-30 Code:

    R-PDSO-G12

  • JESD-609 Code:

    e3

  • Length:

    4.039 mm

  • Line Regulation-Max:

    0.0165%

  • Load Regulation-Max:

    0.033%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    12

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -55 °C

  • Output Current1-Max:

    0.1 A

  • Output Voltage1-Max:

    3.366 V

  • Output Voltage1-Min:

    3.234 V

  • Output Voltage1-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    SOLCC12,.08,18

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Voltage Tolerance-Max:

    2%

  • Width:

    3 mm

LT3050MPMSE-3.3#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT3050 involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing trace lengths and widths to reduce noise and EMI. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Also, ensure that the output capacitor has a low ESR and is properly decoupled from the input capacitor. Additionally, avoid using capacitors with high ESL and ESR values.
  • The maximum input voltage that the LT3050 can handle is 15V. However, it's recommended to operate the device within the specified input voltage range of 3.5V to 12V for optimal performance and reliability.
  • The LT3050 is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's recommended to derate the output current and ensure proper thermal management to prevent overheating.
  • To troubleshoot issues with the LT3050, start by checking the input voltage, output voltage, and output current. Verify that the device is properly powered and that the output is not overloaded. Check for noise and EMI issues, and ensure that the PCB layout and component values meet the recommended specifications.

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LT3050MPMSE-3.3#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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