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LT3430IFE#PBF - Analog Devices

Description: Linear Technology, LT3430IFE#PBF Switching Regulator 3A, 1.2 → 68 V, 16-Pin TSSOP

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LT3430IFE#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - FE Package
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LT3430IFE#PBF Details

  • Manufacturer Part Number:

    LT3430IFE#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    16

  • Manufacturer Package Code:

    05-08-1663 (BB)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Input Voltage-Max:

    60 V

  • Input Voltage-Min:

    5.5 V

  • Input Voltage-Nom:

    15 V

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    6.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    228 kHz

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

LT3430IFE#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT3430IFE#PBF involves keeping the input and output capacitors close to the IC, using a solid ground plane, and minimizing trace lengths and widths to reduce EMI and noise. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure the LT3430IFE#PBF operates within its SOA, monitor the input voltage, output current, and ambient temperature. Ensure the device is properly heatsinked, and the thermal resistance (θJA) is minimized. Use the thermal derating curves in the datasheet to determine the maximum allowable power dissipation.
  • When selecting input and output capacitors for the LT3430IFE#PBF, consider the capacitor's equivalent series resistance (ESR), capacitance value, and voltage rating. Choose capacitors with low ESR, high capacitance, and a voltage rating that exceeds the maximum input voltage. X5R or X7R ceramic capacitors are recommended.
  • To troubleshoot issues with the LT3430IFE#PBF, start by verifying the input voltage, output voltage, and output current. Check the PCB layout for any signs of noise or EMI. Use an oscilloscope to measure the output voltage and current waveforms. Consult the datasheet and application notes for guidance on troubleshooting common issues.
  • Operating the LT3430IFE#PBF at high ambient temperatures can reduce its reliability and lifespan. The device's maximum junction temperature (TJ) is 150°C. Ensure the device is properly heatsinked, and the thermal resistance (θJA) is minimized. Use the thermal derating curves in the datasheet to determine the maximum allowable power dissipation.

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LT3430IFE#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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