A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
Ensure that the input voltage rises monotonically and does not droop during start-up. Also, ensure that the EN pin is driven high before the input voltage reaches the UVLO threshold during start-up, and driven low before the input voltage falls below the UVLO threshold during shutdown.
The maximum capacitive load that can be driven by the device is 10nF. Exceeding this limit may cause instability or oscillations.
Use a shielded inductor, keep the switching node (SW pin) away from sensitive nodes, and use a common-mode choke or ferrite bead to filter the input voltage. Also, ensure that the PCB layout is compact and the components are placed close to the device.
A low-ESR ceramic capacitor with a value of 10uF to 22uF is recommended. The capacitor should be placed close to the VIN pin and the GND pin.
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