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LT3761IMSE#PBF - Analog Devices

Description: LED Lighting Drivers 60VIN LED Cntr w/ Int PWM Gen

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PCB Footprints
LT3761IMSE#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MSE Package 16-Lead Plastic MSOP, Exposed Die Pad (Reference LTC DWG # 05-08-1667 Rev F)
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3D Models
LT3761IMSE#PBF - Analog Devices  - 3D model - Small Outline Packages - MSE Package 16-Lead Plastic MSOP, Exposed Die Pad (Reference LTC DWG # 05-08-1667 Rev F)
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LT3761IMSE#PBF Details

  • Manufacturer Part Number:

    LT3761IMSE#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    05-08-1667

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    4.039 mm

  • Moisture Sensitivity Level:

    1

  • Multiplexed Display Capability:

    NO

  • Number of Functions:

    1

  • Number of Segments:

    8

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP16,.19,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    2.2 mA

  • Supply Voltage-Max:

    60 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    24 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

LT3761IMSE#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT3761IMSE involves keeping the high-current paths short and wide, using a solid ground plane, and placing the input capacitors close to the IC. A 4-layer board with a dedicated power plane and a solid ground plane is recommended.
  • The compensation network for the LT3761IMSE involves selecting the right values for the compensation resistors and capacitors. A good starting point is to use the values recommended in the datasheet, and then adjust them based on the specific application and desired performance.
  • The maximum ambient temperature for the LT3761IMSE is 85°C, but it can be derated for higher temperatures. It's essential to ensure good airflow and heat sinking to maintain a safe operating temperature.
  • Yes, the LT3761IMSE is suitable for high-reliability applications. It's manufactured using a high-reliability process, and it's qualified for automotive and industrial applications. However, it's essential to follow proper design and manufacturing practices to ensure the required level of reliability.
  • The LT3761IMSE has built-in overvoltage protection (OVP) and undervoltage lockout (UVLO) features. However, it's still essential to add external protection circuitry, such as a voltage supervisor or a reset IC, to ensure that the device is protected from voltage transients and faults.

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LT3761IMSE#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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