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LT6375HDF#PBF - Analog Devices

Description: LINEAR TECHNOLOGY - LT6375HDF#PBF - Differenzverstärker, Unity-Gain, 1 Verstärker, 575 kHz, -40 °C, 125 °C

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PCB Footprints
LT6375HDF#PBF - Analog Devices PCB footprint - Small Outline No-lead - Small Outline No-lead - DFN-14
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3D Models
LT6375HDF#PBF - Analog Devices  - 3D model - Small Outline No-lead - DFN-14
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LT6375HDF#PBF Details

  • Manufacturer Part Number:

    LT6375HDF#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DFN-14/12

  • Pin Count:

    12

  • Manufacturer Package Code:

    05-08-1963

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Bandwidth (3dB)-Nom:

    0.575 MHz

  • Common-mode Reject Ratio-Min:

    90 dB

  • Common-mode Reject Ratio-Nom:

    100 dB

  • Frequency Compensation:

    NO

  • JESD-30 Code:

    S-PDSO-N12

  • Length:

    4 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -30 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    1

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC12/14,.16,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    0.8 mm

  • Slew Rate-Min:

    1.6 V/us

  • Slew Rate-Nom:

    2.4 V/us

  • Supply Current-Max:

    0.6 mA

  • Supply Voltage Limit-Max:

    30 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Wideband:

    NO

  • Width:

    4 mm

LT6375HDF#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT6375HDF involves keeping the input and output traces short and wide, using a solid ground plane, and placing the input and output capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Also, ensure that the output capacitor has a low equivalent series resistance (ESR) and is placed close to the device. Additionally, a minimum of 10uF output capacitance is recommended.
  • The maximum input voltage that the LT6375HDF can handle is 80V. Exceeding this voltage may damage the device.
  • The LT6375HDF is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's recommended to derate the device's performance and consider thermal management techniques to ensure reliable operation.
  • To troubleshoot issues with the LT6375HDF, start by checking the input and output voltages, and ensuring that the device is properly powered. Check for any signs of overheating, and verify that the PCB layout and component values meet the recommended guidelines. If issues persist, consult the datasheet and application notes for further guidance.

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LT6375HDF#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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