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LT6700HS6-2#WTRMPBF - Analog Devices

Description: Analog Comparators uP, L V, 2x Comp w/ 400mV Ref

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LT6700HS6-2#WTRMPBF - Analog Devices PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - S6 Package 6-Lead Plastic TSOT-23
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LT6700HS6-2#WTRMPBF - Analog Devices  - 3D model - SOT23 (6-Pin) - S6 Package 6-Lead Plastic TSOT-23
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LT6700HS6-2#WTRMPBF Details

  • Manufacturer Part Number:

    LT6700HS6-2#WTRMPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSOT-23, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    05-08-1636

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Amplifier Type:

    COMPARATOR

  • Average Bias Current-Max (IIB):

    0.05 µA

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Type:

    OPEN-COLLECTOR

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Equivalence Code:

    TSOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Response Time-Nom:

    29000 ns

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    0.019 mA

  • Supply Voltage Limit-Max:

    18.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.625 mm

LT6700HS6-2#WTRMPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT6700HS6-2 involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing bypass capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure stability, make sure to follow the recommended compensation network, choose the correct output capacitor, and ensure that the input voltage is within the recommended range. Additionally, avoid capacitive loading on the output and ensure that the device is operated within its recommended operating conditions.
  • The maximum power dissipation of the LT6700HS6-2 is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C ambient temperature. However, this value can be derated based on the actual operating conditions.
  • The LT6700HS6-2 is rated for operation up to 125°C junction temperature. However, the device's performance and reliability may be affected at high temperatures. It is recommended to derate the power dissipation and ensure proper thermal management to ensure reliable operation.
  • To troubleshoot issues with the LT6700HS6-2, start by checking the input voltage, output voltage, and current. Verify that the device is operated within its recommended operating conditions and that the PCB layout is correct. Use an oscilloscope to check for oscillations or other anomalies. Consult the datasheet and application notes for troubleshooting guides and FAQs.

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LT6700HS6-2#WTRMPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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