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LT8350SAV#WPBF - Analog Devices

Description: Switching Voltage Regulators 40VIN, 18VOUT, 6A Sync Buck-Boost SS

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LT8350SAV#WPBF Details

  • Manufacturer Part Number:

    LT8350SAV#WPBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LQFN-32

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE SKIP MODE

  • Input Voltage-Max:

    40 V

  • Input Voltage-Min:

    3 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-XQCC-N32

  • Length:

    6 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    8 A

  • Output Voltage-Max:

    18 V

  • Output Voltage-Min:

    1 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HQCCN

  • Package Equivalence Code:

    LCC32,.16X.24,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.03 mm

  • Supply Current-Max (Isup):

    0.65 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    2070 kHz

  • Technology:

    BIPOLAR

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    4 mm

LT8350SAV#WPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT8350SAV#WPBF involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the traces between the device and the capacitors. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane to reduce noise and improve performance.
  • The selection of input and output capacitors for the LT8350SAV#WPBF depends on the specific application requirements. In general, it's recommended to use low-ESR capacitors with a high ripple current rating. For the input capacitor, a value of 10uF to 22uF is recommended, while for the output capacitor, a value of 22uF to 47uF is recommended. The capacitor voltage rating should be at least 1.5 times the maximum input voltage.
  • The LT8350SAV#WPBF can operate at ambient temperatures up to 125°C, but the device's performance and reliability may be affected at high temperatures. It's recommended to derate the device's performance and ensure proper thermal management to prevent overheating.
  • To ensure the LT8350SAV#WPBF is stable and doesn't oscillate, it's recommended to follow the layout guidelines in the datasheet, use the recommended input and output capacitors, and ensure that the device is properly decoupled from the input and output rails. Additionally, it's recommended to add a small resistor (e.g. 1kΩ) in series with the output capacitor to dampen any oscillations.
  • The LT8350SAV#WPBF can deliver up to 2A of output current, but the device's performance and reliability may be affected at high output currents. It's recommended to derate the device's performance and ensure proper thermal management to prevent overheating.

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LT8350SAV#WPBF Overview

Use the download button to access the LT8350SAV#WPBF 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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